Non-Volatile Memory Arrays Comprising Rail Stacks with a Shared Diode Component Portion for Diodes of Electrically Isolated Pillars

ABSTRACT

An integrated circuit including vertically oriented diode structures between conductors and methods of fabricating the same are provided. Two-terminal devices such as passive element memory cells can include a diode steering element in series with an antifuse and/or other state change element. The devices are formed using pillar structures at the intersections of upper and lower sets of conductors. The height of the pillar structures are reduced by forming part of the diode for each pillar in a rail stack with one of the conductors. A diode in one embodiment can include a first diode component of a first conductivity type and a second diode component of a second conductivity type. A portion of one of the diode components is divided into first and second portions with one on the portions being formed in the rail stack where it is shared with other diodes formed using pillars at the rail stack.

BACKGROUND OF THE INVENTION

1. Field of the Invention

Embodiments in accordance with the present disclosure are directed tointegrated circuits containing non-volatile memory cell arrays andparticularly those arrays incorporating passive element memory cells.

2. Description of the Related Art

Materials having a detectable level of change in state, such as aresistance or phase change, are used to form various types ofnon-volatile semiconductor based memory devices. For example, simpleantifuses are used for binary data storage in one timefield-programmable (OTP) memory arrays by assigning a lower resistanceinitial physical state of a memory cell to a first logical state such aslogical ‘0,’ and assigning a higher resistance physical state of thecell to a second logical state such as logical ‘1.’ Some materials canhave their resistance switched back in the direction of their initialresistance. These types of materials can be used to form re-writablememory cells. Multiple levels of detectable resistance in materials canfurther be used to form multi-state devices which may or may not bere-writable.

Materials having a memory effect such as a detectable level ofresistance are often placed in series with a steering element to form amemory cell. Diodes or other devices having a non-linear conductioncurrent are typically used as the steering element. The memory effect ofthe cell is often referred to as the state change element. In manyimplementations, a set of word lines and bit lines are arranged in asubstantially perpendicular configuration with a memory cell at theintersection of each word line and bit line. Two-terminal memory cellscan be constructed at the intersections with one terminal (e.g.,terminal portion of the cell or separate layer of the cell) in contactwith the conductor forming the respective word line and another terminalin contactor with the conductor forming the respective bit line. Suchcells are sometimes referred to as passive element memory cells.

Two-terminal memory cells with resistive state change elements have beenused in three-dimensional field programmable non-volatile memory arraysbecause of their more simple design when compared to otherthree-terminal memory devices such as flash EEPROM. Three-dimensionalnon-volatile memory arrays are attractive because of their potential togreatly increase the number of memory cells that can be fabricated in agiven wafer area. In three-dimensional memories, multiple levels ofmemory cells can be fabricated above a substrate, without interveningsubstrate layers. One type of three-dimensional memory includes pillarsof layers formed at the intersection of upper and lower conductors. Thepillars can take on various configurations, including a steering elementsuch as a diode in series with a state change element such as anantifuse or other state change material in one example.

The formation of pillar structures often includes etching a firstplurality of layers into strips in a first direction, filling the gapsbetween strips with a dielectric material, depositing a second pluralityof layers, and then etching both plurality of layers in a seconddirection orthogonal to the first. The formation of these pillarstructures can include a number of fabrication processes that requireprecise alignment in forming the small feature sizes of the structures.These processes can present a range of difficulties. For example, thesecond etch process is typically selective so as not to etch thedielectric fill material. This can sometimes lead to the inadvertentshorting of adjacent structures due to stringers formed from a portionof material trapped under the dielectric and not removed by the secondetch.

There remains a need for improved pillar designs and correspondingfabrication processes for forming the same in non-volatile memory arraytechnologies.

SUMMARY OF THE INVENTION

An integrated circuit including vertically oriented diode structuresbetween conductors and methods of fabricating the same are provided.Two-terminal devices such as passive element memory cells can include adiode steering element in series with an antifuse and/or other statechange element. The devices are formed using pillar structures at theintersections of upper and lower sets of conductors. The height of thepillar structures are reduced by forming part of the diode for eachpillar in a rail stack with one of the conductors. A diode in oneembodiment can include a first diode component of a first conductivitytype and a second diode component of a second conductivity type. Aportion of one of the diode components is divided into first and secondportions with one on the portions being formed in the rail stack whereit is shared with other diodes formed using pillars at the rail stack.

An integrated circuit device according to one embodiment includes afirst conductor elongated in a first direction above a substrate, afirst set of strips including a second conductor and a first portion ofa first diode component, and a pillar formed between the first conductorand the first set of strips. The first set of strips are elongated in asecond direction above the substrate, where the second direction issubstantially orthogonal to the first direction. The pillar includes asecond portion of the first diode component, a second diode component,and a state change element in series between the first conductor and thefirst set of strips.

A non-volatile semiconductor memory in accordance with anotherembodiment includes a substrate, a plurality of substantially paralleland substantially coplanar first conductors at a first height above thesubstrate, a plurality of substantially parallel and substantiallycoplanar rail stacks at a second height above the substrate, and aplurality of pillars formed between intersections of the plurality offirst conductors and the plurality of rail stacks. The first conductorsare elongated in a first direction and the rail stacks are elongated ina second direction substantially orthogonal to the first direction. Eachrail stack includes a second conductor and a first portion of a firstdiode component for a plurality of diodes associated with the railstack. The plurality of pillars include a first set of pillars formed atthe intersection of a first rail stack and the plurality of firstconductors. The first set of pillars each include a second portion ofthe first diode component for the plurality of diodes associated withthe first rail stack, a second diode component and a state changeelement.

A method of fabricating an integrated circuit device is provided in oneembodiment that includes forming a plurality of substantially paralleland substantially coplanar first conductors at a first height above asubstrate, forming a plurality of substantially parallel andsubstantially coplanar rail stacks at a second height above thesubstrate, and forming a plurality of pillars between intersections ofthe plurality of first conductors and the plurality of rail stacks. Thefirst conductors are elongated in a first direction and the rail stacksare elongated in a second direction that is substantially orthogonal tothe first direction. Each rail stack includes a second conductor and afirst portion of a first diode component for a plurality of diodes ofpillars associated with the rail stack. The plurality of pillars caninclude a first set of pillars formed at the intersection of a firstrail stack and the plurality of first conductors. The first set ofpillars can each include a second portion of the first diode componentfor the plurality of diodes corresponding to the first rail stack, asecond diode component and a state change element.

Other features, aspects, and objects of the disclosed technology can beobtained from a review of the specification, the figures, and theclaims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 depicts an exemplary two-terminal non-volatile memory cell havinga steering element in series with a state change element and antifuse.

FIG. 2 depicts an exemplary two-terminal non-volatile memory cell havingan antifuse layer between diode components.

FIGS. 3A and 3B are respective perspective and cross-sectional views ofa three-dimensional memory array.

FIG. 4A is a perspective view of a portion of a non-volatile memoryarray in accordance with one embodiment of the disclosed technology.

FIG. 4B is another perspective view of the non-volatile memory array ofFIG. 4A, depicting the hole current flow in unselected and selectedpillars during a non-volatile memory operation.

FIG. 5 is a graph depicting the hole current in unselected array linesas a function of the height of the pillar.

FIGS. 6A-6I are cross-section views depicting the fabrication of anon-volatile memory array in accordance with one embodiment of thedisclosed technology.

FIG. 7 is block diagram of a non-volatile memory system in accordancewith one embodiment.

DETAILED DESCRIPTION

FIG. 1 depicts an exemplary structure of a two-terminal non-volatilememory cell including a pillar 100 of layers formed at an intersectionbetween upper and lower conductors. A first terminal portion of thememory cell is connected to a first conductor 110 and a second terminalportion of the memory cell is connected to a second conductor 112. Thememory cell is co-extensive with pillar 100, including a steeringelement 102 in series with a state change element 104 and an anti-fuse106 to provide non-volatile date storage.

The steering element can take the form of any suitable device exhibitinga nonlinear conduction current characteristic such as a simple diode.The state change element will vary by embodiment and can includenumerous types of materials to store data through representativephysical states. State change element 104 can include resistance changematerials, phase change resistive materials, etc. A semiconductor orother material having at least two levels of detectable resistancechange (e.g., low to high and high to low) can be used to form a passivestorage element. By assigning logical data values to the various levelsof resistance that can be set and read from resistance change element104, the memory cell formed from pillar 100 can provide reliable dataread/write capabilities. Anti-fuse 106 can further provide resistancestate change abilities that can be exploited for non-volatile datastorage. An anti-fuse is manufactured in a high resistance state and canbe popped or fused to a lower resistance state. An anti-fuse istypically non-conductive in its initial state and exhibits highconductivity with low resistance in its popped or fused state. As adiscreet device or element may have a resistance and differentresistance states, the terms resistivity and resistivity state are usedto refer to the properties of materials themselves. Thus, while aresistance change element or device may have resistance states, aresistivity change material may have resistivity states. Various typesof antifuses can be used, including but not limited to dielectricrupture antifuses, intrinsic or lightly doped polycrystallinesemiconductor antifuses and amorphous semiconductor antifuses, forexample.

Anti-fuse 106 can provide benefits to memory cell 100 beyond its statechange ability. For example, an anti-fuse can serve to set theon-resistance of the memory cell in at an appropriate level relative tothe read-write circuitry associated with the cell. These circuits aretypically used to pop the anti-fuse and have an associated resistance.Because these circuits drive the voltages and current levels to pop theanti-fuse, the anti-fuse tends to set the memory cell in an appropriateon-resistance state for these same circuits during later operations.

A variety of materials exhibit resistivity change behavior suitable forimplementing state change element 104. Examples of suitable materialsinclude, but are not limited to, doped semiconductors (e.g.,polycrystalline silicon, more commonly polysilicon), transition metaloxides, complex metal oxides, programmable metallization connections,phase change resistive elements, organic material variable resistors,carbon polymer films, doped chalcogenide glass, and Schottky barrierdiodes containing mobile atoms that change resistance. The resistivityof these materials in some cases may only be set in a first direction(e.g., high to low), while in others, the resistivity may be set from afirst level (e.g., higher resistance) to a second level (e.g., lowerresistance), and then reset back to the first resistivity level. Statechange element 104 can be an antifuse in one embodiment.

A range of resistance values can be assigned to a physical data state toaccommodate differences amongst devices as well as variations withindevices after set and reset cycling. The terms set and reset aretypically used, respectively, to refer to the process of changing anelement from a high resistance physical state to a low resistancephysical state (set) and changing an element from a low resistancephysical state to a higher resistance physical state (reset).

Other types of two-terminal non-volatile memory cells can be used inaccordance with embodiments of the present disclosure. For example, oneembodiment does not include an anti-fuse 106 and merely includes statechange element 104 and steering element 102. Other embodiments mayinclude additional state change elements in place of or in addition tothe anti-fuse. Various types of suitable memory cells are described inU.S. Pat. No. 6,034,882 entitled “Vertically Stacked Field ProgrammableNon-volatile Memory and Method of Fabrication.” Various other types ofcells may be used, including those described in U.S. Pat. No. 6,420,215and U.S. patent application Ser. No. 09/897,705 entitled“Three-Dimensional Memory Array Incorporating Serial Chain Diode Stack”filed on Jun. 29, 2001, and U.S. patent application Ser. No. 09/560,626entitled “Three-Dimensional Memory Array and Method of Fabrication”filed on Apr. 28, 2000, all hereby incorporated by reference in theirentirety.

FIG. 2 depicts another exemplary structure of a two-terminalnon-volatile memory cell formed from a pillar of layers at theintersection of upper and lower conductors. In this example, thesteering element is a diode having a first diode component 114 and asecond diode component 116 separated by an antifuse layer 106. Sucharrangements are sometimes referred to as incipient diodes. The diodecan include various combinations of materials of different conductivitytypes suitable for forming an appropriate diode junction. For example,the first diode component 114 can be a highly doped polysilicon layerand the second component an intrinsic or lightly doped polysilicon layerof a different conductivity type. Undoped regions may not be perfectlyelectrically neutral, resulting from defects, contaminants, etc. thatmay cause it to behave as is slightly doped. Such a diode is stillconsidered to have an intrinsic layer. In one embodiment, the firstcomponent 114 is a heavily doped P+ silicon layer and the secondcomponent is an intrinsic or lightly doped N− layer 116. Of course, theN− and P+ type layers can be reversed in another embodiment.Additionally, a heavily doped N+ silicon layer can be used for onecomponent and an intrinsic or lightly doped P− silicon layer used forthe other component. The second component can also be heavily doped inanother example.

A state change element 104 is not included in FIG. 2, although one canbe added in series with the antifuse and diode in another embodiment. Itis noted that the diode steering element itself may be used as a statechange element in one embodiment. It has been discovered that materialsused to form the diodes in some memory cells themselves exhibitresistive change abilities. For example, in one embodiment the intrinsicregion of the diode is formed of polysilicon which has demonstratedabilities to be set from a higher resistivity state to a lowerresistivity state, and then reset back to a higher resistivity statefrom the lower resistivity state. Accordingly, the diode itself, or aportion thereof, may also form a state change element for the memorycell. In other embodiments, one or more additional layers may beincluded in pillar 100 for the memory cell to form a state changeelement. For example, an additional layer of polysilicon, transitionmetal oxide, etc. may be included in the cell to provide a state changememory effect. This additional layer may be included between a diodecomponent and one of the conductors, for example.

Conductors 110 and 112 are typically orthogonal to one another and formpart of the array terminal lines for accessing an array of memory cells.The array terminal lines (also called array lines) at one layer may betermed word lines or X-lines. The array lines at a vertically adjacentlayer may be termed bit lines or Y-lines. A memory cell can be formed atthe projected intersection of each word line and each bit line, andconnected between the respective intersecting word line and bit line asshown for the formation of a memory cell at the pillar 100. Athree-dimensional memory array which has at least two levels of memorycells (i.e., two memory planes) may utilize more than one layer of wordlines and/or more than one layer of bit lines.

FIGS. 3A-3B depict a portion of an exemplary monolithicthree-dimensional memory array. A monolithic three dimensional memoryarray is one in which multiple memory levels are formed above a singlesubstrate, such as a wafer, with no intervening substrates. Both theword line and bit line layers are shared between memory cells in thestructure depicted in the perspective view of FIG. 3A. Thisconfiguration is often referred to as a fully mirrored structure. Aplurality of substantially parallel and coplanar conductors form a firstset of bit lines 162 at a first memory level L0. Memory cells 152 atlevel L0 include pillars formed between the bit lines and adjacent wordlines 164. In the arrangement of FIGS. 3A-3B, word lines 164 are sharedbetween memory layers L0 and L1 and thus, further connect to memorycells 170 at memory level L1. A third set of conductors form the bitlines 174 for these cells at level L1. These bit lines 174 are in turnshared between memory levels L1 and memory level L2, depicted in thecross-sectional view of FIG. 3B. Memory cells 178 are connected to bitlines 174 and word lines 176 to form the third memory level L2, memorycells 182 are connected to word lines 176 and bit lines 180 to form thefourth memory level L3, and memory cells 186 are connected to bit lines180 and word lines 184 to form the fifth memory level L5. Thearrangement of the diodes' polarity and the respective arrangement ofthe word lines and bit lines can vary by embodiment. Additionally, moreor less than five memory levels can be used.

The diode steering elements for a given memory cell level in theembodiment of FIG. 3A can be formed upside down relative to the diodesof the previous memory cell level. For example, if cells 152 include abottom heavily doped region that is P+ type and a top intrinsic orlightly doped N− type region, then in the second level of cells 170, thebottom heavily doped region may be N− type while the top heavily dopedregion is P+ type.

In an alternative embodiment, an inter-level dielectric can be formedbetween adjacent memory levels. No conductors are shared between memorylevels. This type of structure for three-dimensional monolithic storagememory is often referred to as a non-mirrored structure. In someembodiments, adjacent memory levels that share conductors and adjacentmemory levels that do not share conductors can be stacked in the samemonolithic three dimensional memory array. In other embodiments, someconductors are shared while others are not. For example, only the wordlines or only the bit lines can be shared in some configurations. Afirst memory level L0 can include memory cells between a bit line levelBL0 and word line level WL0. The word lines at level WL0 can be sharedto form cells at a memory level L1 that connect to a second bit linelevel BL1. The bit line layers are not shared so the next layer caninclude an interlayer dielectric to separate bit lines BL1 from the nextlevel of conductors. This type of configuration is often referred to ashalf-mirrored. Memory levels need not all be formed having the same typeof memory cell. If desired, memory levels using resistive changematerials can alternate with memory levels using other types of memorycells, etc.

FIG. 4A depicts a portion of a monolithic three-dimensional non-volatilememory array in accordance with one embodiment of the presentdisclosure. Memory cells are formed using pillar structures 230 at theintersection between first conductors 202 and second conductors 204.Only one first conductor 202 is depicted in FIG. 4A for clarity. Eachsecond conductor 204 is part of a rail stack of layers that furtherincludes a heavily doped N+ type silicon layer 206 and intrinsic orlightly doped N− type silicon layer 208. The rail stacks are separatedfrom adjacent rail stacks by strips 210 of dielectric material, such assilicon oxide. Heavily doped layer 206 provides good electrical contactto the underlying metal conductor layer 204. This highly doped siliconlayer will stop ohmic transitions, thereby preventing the unintendedformation of Schottky diodes at the junction of the metal conductor withan underlying intrinsic or lightly doped layer, for example. Variousdoping techniques can be used in forming the doped materials describedherein. By way of example, in-situ doping during deposition can be usedin one embodiment. Other doping techniques such as ion implantation,plasma immersion, gas source diffusion or solid source diffusion canalso be used. Moreover, different doping techniques can be used whenforming different layers of the array in one embodiment.

A plurality of pillar structures 230 are formed over layer 208, eachincluding an additional layer 212 of intrinsic or lightly doped N− typesilicon, an antifuse layer 214, and a layer 216 of heavily doped P+ typesilicon. P+ type silicon layer 216 forms a first diode component for thememory cell of the corresponding pillar. The lightly doped or intrinsicN− type silicon layer 212 in each pillar forms a first portion of asecond diode component for the memory cell of the corresponding pillar.The second diode component for each memory cell further includes asecond portion formed from the underlying strips 208 of intrinsic orlightly doped N− type material. These strips 208 are thereby shared byevery overlying pillar along its length in the first direction to form aportion of the second diode component for each pillar.

By moving a portion of the second diode component to rail stack 220, areduced height pillar is formed. It has been discovered that someportion of the second diode component can be moved to the rail stackwithout adversely affecting the electrical performance of the memorycell. In this manner, the pillar height can be reduced while stillforming discrete memory cells at the intersection of the upper and lowerconductors. More details are provided below with respect to theelectrical effects of forming a second portion of the second diodecomponents in the rail stacks.

Although the first diode component is heavily doped P+ type silicon andthe second diode component is intrinsic or lightly doped N− type siliconin FIG. 4A, different material combinations can be used to form thediode steering element. For example, a heavily doped N+ type materialcan be paired with an intrinsic or lightly doped P− type material is analternate implementation. Additionally, the orientation of the materialswill respect to the upper and lower conductors can be reversed in otherembodiments.

FIG. 4B depicts a portion of the non-volatile memory from FIG. 4A,illustrating that memory cells of the described array can beindividually selected without disturbing unselected memory cells thatconnect to common selection lines. The orientation of the array has beenflipped vertically in FIG. 4B and some portions omitted for the sake ofclarity of presentation. A set of bias conditions are depicted forselecting the memory cell formed at pillar 230 a, while not selectingthe memory cell formed at pillar 230 b. The bias conditions may be usedto program the memory cell by popping or rupturing antifuse 214 a atpillar 230 a for example. It is important in such an operation tosufficiently isolate the memory cell at pillar 230 a so that antifuse214 a can be adequately ruptured, while not disturbing or otherwiseaffecting antifuse 214 b. In the particularly described embodiment, 10Vis applied to selected first conductor 202 a, while 1V is applied tounselected first conductor 202 b and selected conductor 204 a isgrounded. Other unselected conductors 204 a (not shown) in the secondset of conductors can have a voltage of about 8V applied thereon in oneembodiment.

Under the applied bias conditions, a strong electric field is generatedthrough pillar 230 a, with a direction from conductor 202 a to conductor204 a. Because N− layer 208 a is a common node electrically coupled toboth pillars 230 a and 230 b, an induced current flow between selectedconductor 202 a and unselected conductor 220 b through N− layer 208 amay be expected. Such a driven current flow may raise concerns that thememory cell at pillar 230 b may inadvertently be programmed ordisturbed. It has been discovered, however, that some portion of thesecond diode component can be shared in a common rail stack while stillavoiding unintentional disturb of the memory cells in unselectedpillars.

The strong electrical field between conductor 202 a and conductor 204 ainduces an injection hole current flow depicted by arrows 240 in thedirection of the electric field. An electric field also exists in theunselected pillar 230 b in a direction from conductor 202 b to conductor204 a. This electric field also induces a hole current with a directionfrom conductor 202 b to conductor 220 a denoted by arrows 242. Althoughsmaller than the electric field in the selected pillar, the electricfield in the unselected pillar can be sufficiently strong to repel amajority of the injection holes from reaching the unselected antifuse214 b, thereby avoiding a disturb of the memory cell at pillar 230 b.

It is noted that a minority diffusion hole current may still reach theantifuse layer in unselected memory cells. However, the diffusioncurrent decreases exponentially with distance such that an appropriateheight of the pillar can be selected to minimize or eliminate anydisturb issues that may be caused by the minority current. FIG. 5 is agraph showing the relationship between the minority diffusion holecurrent and the height of the pillar in one exemplary implementation.The hole current is expressed logarithmically along the y-axis asfunction of the pillar height, which is set forth along the x-axis. Inthe particularly described embodiment, an overall height of the N− layerforming the second portion of the diode component and the pillar isassumed to be about 3000 angstroms(A). As the height of the pillar isdecreased, the height of the N− layer in the rail stack is increased bya corresponding amount so that the total height remains about 3000 A.

The current in a selected conductor 202 a under the applied biasconditions is shown by line 250 and the current in an unselectedconductor 202 b is shown by line 252. At a pillar height of about 450 A,the current in the selected conductor is slightly more than 1×10⁻⁰³amps, while the current in the unselected conductor is slightly lessthan 1×10⁻⁰⁴ amps. This level of current in the unselected pillars maybe expected to create disturbance of the corresponding memory cells,such as by rupturing anti-fuses 214 b. As the height of the pillar isincreased, the current in the selected conductor remains about the same,while the current in the unselected conductor decreases. At a height ofabout 1050 A, the current in the unselected conductor drops to about1×10⁻⁶ amps. This current may be low enough not to pose a disturbconcern. At about 1300 A, the current has dropped further to about1×10⁻⁷ amps. It is noted that the actual values expressed in FIG. 5 areexemplary only and will vary according to the materials, dopant levelsand dimensions of the other layers in a given implementation. Fabricateddevices can undergo testing to characterize the amount of disturbexperienced at different pillar heights in order to precisely select anappropriate dimension for the desired implementation.

FIGS. 6A-6I schematically illustrate the fabrication of a monolithicthree-dimensional non-volatile memory array in accordance with oneembodiment. The described fabrication may take place after forming oneor more underlying memory levels in one embodiment. An insulating layer302L is formed over a substrate (not shown) as shown in FIG. 6A. In someembodiments, the insulating layer 302L may be omitted, such as where amirrored cell level arrangement is used and the processes are used toform an additional memory level over one or more preceding levels. Theunderlying substrate can be any semiconductor substrate, such as amonocrystalline silicon, IV-IV compounds, III-V compounds, II-VIIcompounds, etc. and include epitaxial or other semiconductor layersformed over the substrate. The substrate may include integrated circuitsformed therein. Insulating layer 302L can include any suitableinsulating material such as silicon dioxide, silicon nitride,high-dielectric films, etc.

An optional adhesion layer 304L is formed over the insulating materialto help conducting layer 306L adhere. The adhesion layer can include, byway of non-limiting example, materials such as tantalum nitride,tungsten nitride, titanium tungsten, sputtered tungsten, titaniumnitride or combinations of the same. The adhesion layer can be formed byany process known in the art, such as chemical vapor deposition (CVD),physical vapor deposition (PVD) or atomic layer deposition (ALD). In oneembodiment, adhesion layer 304L is deposited to a thickness of about 100A. The term thickness refers to vertical thickness, measured in adirection perpendicular to the substrate on which the layer is formed.

Conducting layer 306L is formed over adhesion layer 304L using knownprocesses such as CVD or PVD. The conducting layer can include anysuitable conductive material known in the art, including but not limitedto tantalum, titanium, tungsten, copper, cobalt or alloys thereof. Inone embodiment, Tungsten is deposited by CVD to a thickness of about3000 A, although the thickness, material and process used can vary byembodiment. An optional adhesion layer 308L is formed over the firstconducting layer 306L to a thickness of about 100 A. The adhesion layercan be formed of different materials as described for layer 304L. Asilicon layer 310L having a first conductivity type is formed overconducting layer 308L. The silicon layer is a heavily-doped P+ typepolysilicon layer in one embodiment having a thickness of about 200 A.Other thicknesses can be used. By way of example, the heavily doped P+polysilicon layer can be doped at a concentration greater than 5×10¹³atoms/cm³ in one embodiment. The P+ layer is doped at a concerntrationgreater than 1×10¹⁹ atoms/cm³ in another embodiment, and at aconcentration greater than 1×10²⁰ atoms/cm³ in yet another embodiment.

An antifuse layer 312L is formed over the heavily doped P+ type layer.The antifuse material is silicon dioxide in one embodiment that isdeposited to a thickness of about 20-100 A. Other thicknesses can beused. A silicon layer 314L of material having a different conductivitytype than layer 310L is formed over the antifuse layer. Layer 314L willform the first portion of a second diode component for each pillar. Whenlayer 310L is a heavily doped P+ type silicon layer, layer 314L can bean undoped intrinsic silicon layer or a lightly doped silicon layer ofan opposite conductivity type, namely N− in this example. In oneembodiment layer 314L is deposited to a thickness of about 1300 A. Inone embodiment where layer 314L is a lightly doped N-type material, thesilicon is doped at a concentration less than 5×10¹⁷ atoms/cm³. Inanother embodiment, a concentration of less than 1×10¹ atoms/cm³ or1×10¹⁶ atoms/cm³ is used. A hard mask layer 316L is formed over N− layer314L. Any suitable hard mask material can be used, including but notlimited to silicon nitride for example. Strips 318 of photoresist arethen formed over the hard mask using conventional photolithographytechniques. The strips of photoresist are elongated in a first directionover the hard mask with spaces between strips adjacent in a seconddirection that is substantially perpendicular to the first direction.Spacer-assisted patterning or nano-imprint technologies can also be usedto form a pattern at less than the minimum definable feature size of thephotolithography process being used in one embodiment.

Using the photoresist as a pattern, the hard mask layer is etched,followed by etching through the underlying layers as depicted in FIG.6B. Etching proceeds until insulating layer 302L is reached. Anysuitable etching process or processes can be used. The layers are etchedinto strips that are elongated in the first direction with spacesbetween strips that are adjacent in the second direction. The width ofthe strips can vary by embodiment, but in one embodiment is about 450 A.Etching the layer stack forms a first set of conductors 306S(1)-(3) thatare elongated in the first direction over the substrate. Layers 308L,310L, 312L 314L and 316L are all etched into strips 308S(1)-(3),310S(1)-(3), 312S(1)-(3), 314S(1)-(3) and 316S(1)-(3)

After etching to form the first conductors, the strips of photoresistand hard mask strips 316S(1)-(3) are removed. Conventional processessuch as ashing in an oxygen-containing plasma can be used to remove thephotoresist, followed by conventional processes such as a chemical wetetch to remove the hard mask layer. After removing the photoresist andhard mask, a dielectric material 320 is deposited over and between thestrips as shown in FIG. 6C. The dielectric material can be any suitableelectrically insulating material such as silicon dioxide, siliconnitride or silicon oxynitride. Excess dielectric material is removedusing conventional techniques such as chemical mechanical polishing. Asubstantially planar surface is formed in one embodiment from strips314S(1), 314S(2) and 314S(3) and the upper surface of the dielectricmaterial separating the adjacent strips. The dielectric layer isrecessed just below the upper surface of strips 314S(1)-(3) in anotherembodiment as illustrated in FIG. 6C.

FIG. 6D is a cross-sectional view taken along line A-A in FIG. 6Cshowing a view through the array in the first direction. An adhesionlayer strip 304S(1) overlies insulating layer 302L, followed by a firstconductor 306S(1), another adhesion layer strip 308S(1), a heavily dopedP+ silicon strip 310S(1), an antifuse layer strip 312S(1), and anintrinsic or lightly doped silicon strip 314S(1).

Over strip 314S(1) is then formed a second layer 330L of material havinga different conductivity type than layer 310L. Layer 330L has the sameconductivity type of material 314L and will form a second portion of thesecond diode component for multiple memory cells. Layer 330L is a secondlayer of lightly doped N− silicon in one embodiment, having asubstantially similar dopant concentration to that of layer 314L. In oneembodiment, layer 330L is about 1300A, although the thickness can varyby embodiment. Over layer 330L is formed a heavily doped layer 332Lusing conventional processes such as CVD. Layer 332L is a heavily dopedN+ type silicon layer in one embodiment that provides good electricalcontact with the overlying conducting layer and avoids the formation ofSchottky diodes. Layer 332L is formed to a thickness of about 200 A inone embodiment. An adhesion layer 334L is formed over layer 332L. In oneembodiment, the adhesion layer is a layer of TiN deposited to a depth ofabout 100 A, although other materials and thicknesses can be used asdescribed with respect to layer 304L. A second conducting layer 336L isthen formed over the adhesion layer. In one embodiment, the secondconducting layer 336L is tungsten deposited by CVD or PVD to a thicknessof about 3000 A. Other materials, processes and dimensions can be usedas described with respect to first conducting layer 306L.

A next series of processes is used to form a pattern for etching layers336L, 334L, 332L and 330L into a second set of rail stacks. The patternis also used to etch strips 314S, 312S, 310S and 308S into pillars.First, a layer 338L of silicon is deposited to a thickness of about 300A over conducting layer 336L. An optional adhesion layer can be formedbetween conducting layer 336L and silicon layer 338L. An oxide layer340L is then deposited over the silicon layer to a thickness of about200 A. Other thicknesses can be used. Strips 342 of photoresistelongated in the second direction are formed over the oxide layer. Thestrips of photoresist are separated by spaces in the first direction.

Using the photoresist as a mask, the oxide layer is etched into strips340S(1), 340S(2) and 340S(3) that are elongated in the second directionover the silicon layer as shown in FIG. 6E. After etching, thephotoresist is removed using a suitable process, followed by depositinga layer 344L of cobalt in the spaces between adjacent strips 340S ofoxide layer 340L and over the upper surface of each strip. Cobalt showsgood resistance to etching so that it can form a suitable hard maskinglayer for etching. In one embodiment, cobalt layer 344L is formed to adepth of about 500 A. After depositing the cobalt, the wafer is annealedat a high temperature (e.g., 650° C.), causing the growth of cobaltsilicon (CoSi) in the areas between adjacent strips of the oxide layer.FIG. 6F depicts strips 346S(1), 346S(2) and 346S(3) of CoSi resultingfrom the annealing process.

After annealing, the remaining portions of cobalt layer 344L, oxidelayer 340L and silicon layer 338L are removed as shown in FIG. 6G. Achemical wet etch is used in one embodiment to strip these layers.Selective or non-selective etch processes can also be used. The stripsof CoSi can then be used as a mask for etching the underlying layers.Etching proceeds through the underlying layers until adhesion layer 304Lis reached as shown in FIG. 6H. A selective etch process is used in oneembodiment to etch through these layers while not etching the dielectricmaterial 320 that was used to fill the spaces between the strips formedfrom the first etch process. Etching conductive layer 336L forms asecond set of conductors 336S(1), 336S(2), 336S(3) that are elongated inthe second direction across the substrate with spaces therebetween inthe first direction. The second set of conductors are part of a set ofrail stacks, which further include strips 334S(1)-(3) of adhesion layer334L, strips 332 S(1)-(3) of heavily doped N+ type ohmic contact layer332L and strips 330 S(1)-(3) of intrinsic or lightly doped layer 330L.Etching strips 314S(1), 312S(1), 310S(1) and 308S(2) forms pillars. Afirst pillar is formed from regions 308P(1), 310P(1), 312P(1) and314P(1), a second pillar is formed from regions 308P(2), 310P(2),312P(2) and 314P(2) and a third pillar is formed from regions 308P(3),310P(3), 312P(3) and 314P(3).

Following etching, another layer 350 of dielectric material is depositedover and between the rail stacks and pillars. Any suitable electricallyinsulating material such as silicon oxide can be used. An additionaldielectric layer can be formed over dielectric layer 350 to form aninter-level dielectric layer to isolate the just formed memory levelfrom a subsequently formed memory level. In other embodiments, aninter-level dielectric layer is not formed so that conductors 336S(1),etc. can be shared by the next memory level in a mirrored orhalf-mirrored arrangement. The CoSi hard mask layer can be removed inone embodiment before forming additional memory levels, although this isnot required.

The aforementioned fabrication process is but one example of a suitabletechnique for forming a three-dimensional memory array having a portionof a diode component formed in a rail stack. In one embodiment forexample, a damascene process can be used to form the intrinsic orlightly doped diode component material for the pillars. After forminglower rail stacks, each including an intrinsic or lightly doped diodecomponent layer, oxide can be deposited as a gap fill between railstacks and also above the rail stacks to the desired height of thepillars above the lower rail stacks. The oxide can be patterned, e.g. byprinting to define locations therein for the pillars. The oxide can thenbe etched to define holes in the oxide into which is deposited theintrinsic or lightly doped silicon layer for pillar formation.Processing can then continue in a similar fashion to that as alreadydescribed.

FIG. 7 is a block diagram of an exemplary integrated circuit including amemory array 402 that may be formed as described in FIGS. 4A-4B and6A-6I. The array terminal lines of memory array 402 include the variouslayer(s) of word lines organized as rows, and the various layer(s) ofbit lines organized as columns. The integrated circuit 400 includes rowcontrol circuitry 420 whose outputs 408 are connected to respective wordlines of the memory array 402. The row control circuitry receives agroup of M row address signals and one or more various control signals,and typically may include such circuits as row decoders 422, arrayterminal drivers 424, and block select circuitry 426 for both read andwrite (i.e., programming) operations. The integrated circuit 400 alsoincludes column control circuitry 410 whose input/outputs 406 areconnected to respective bit lines of the memory array 402. The columncontrol circuitry 406 receives a group of N column address signals andone or more various control signals, and typically may include suchcircuits as column decoders 412, array terminal receivers or drivers414, block select circuitry 416, as well as read/write circuitry, andI/O multiplexers. Circuits such as the row control circuitry 420 and thecolumn control circuitry 410 may be collectively termed controlcircuitry or array terminal circuits for their connection to the variousarray terminals of the memory array 402.

The foregoing detailed description of the invention has been presentedfor purposes of illustration and description. It is not intended to beexhaustive or to limit the invention to the precise form disclosed. Manymodifications and variations are possible in light of the aboveteachings. The described embodiments were chosen in order to bestexplain the principles of the invention and its practical application tothereby enable others skilled in the art to best utilize the inventionin various embodiments and with various modifications as are suited tothe particular use contemplated. It is intended that the scope of theinvention be defined by the claims appended hereto.

1. An integrated circuit device, comprising: a first conductor elongatedin a first direction above a substrate; a first set of strips includinga second conductor and a first portion of a first diode component, thefirst set of strips elongated in a second direction above the substrate,the second direction being substantially orthogonal to the firstdirection; and a pillar formed between the first conductor and the firstset of strips, the pillar including a second portion of the first diodecomponent, a second diode component, and a state change element inseries between the first conductor and the first set of strips.
 2. Theintegrated circuit device of claim 1, wherein: the first portion of thefirst diode component comprises an intrinsic layer of polysilicon; andthe second portion of the first diode component comprises an intrinsiclayer of polysilicon.
 3. The integrated circuit device of claim 2,wherein: the second diode component comprises a heavily doped siliconregion of a first conductivity type.
 4. The integrated circuit device ofclaim 3, wherein the first set of strips further comprises: a heavilydoped polysilicon region of a second conductivity type formed betweenthe second conductor and the first portion of the first diode component.5. An integrated circuit device according to claim 1, wherein: the firstportion of the first diode component comprises a layer of lightly dopedpolysilicon of a first conductivity type; the second portion of thefirst diode component comprises a layer of lightly doped polysilicon ofa first conductivity type; the second diode component comprises aheavily doped polysilicon region of a second conductivity type, thesecond conductivity type being opposite to the first conductivity type.6. The integrated circuit device of claim 1, wherein the state changeelement is an antifuse.
 7. The integrated circuit device of claim 6,wherein the antifuse is formed between the second portion of the firstcomponent and the second diode component.
 8. An integrated circuitdevice according to claim 1, wherein the pillar further comprises anantifuse in series with the first diode component, the second diodecomponent and the state change element.
 9. An integrated circuit deviceaccording to claim 1, wherein: the first conductor, the secondconductor, the first portion of the first diode component, the secondportion of the first diode component and the second diode component format least one non-volatile memory cell.
 10. An integrated circuit deviceaccording to claim 9, wherein the at least one non-volatile memory cellis a field-programmable re-writable memory cell.
 11. An integratedcircuit device according to claim 9, wherein: the integrated circuitincludes a monolithic three-dimensional non-volatile memory array; theat least one non-volatile memory cell is formed at a first memory levelof the monolithic three-dimensional non-volatile memory array; and theintegrated circuit includes at least one additional memory level.
 12. Anon-volatile semiconductor memory, comprising: a substrate; a pluralityof substantially parallel and substantially coplanar first conductors ata first height above the substrate, the first conductors elongated in afirst direction; a plurality of substantially parallel and substantiallycoplanar rail stacks at a second height above the substrate, the railstacks elongated in a second direction substantially orthogonal to thefirst direction, each rail stack including a second conductor and afirst portion of a first diode component for a plurality of diodesassociated with the rail stack; and a plurality of pillars formedbetween intersections of the plurality of first conductors and theplurality of rail stacks, the plurality of pillars including a first setof pillars formed at the intersection of a first rail stack and theplurality of first conductors, the first set of pillars each including asecond portion of the first diode component for the plurality of diodesassociated with the first rail stack, a second diode component and astate change element.
 13. A non-volatile semiconductor memory accordingto claim 12, wherein: the second diode component of each pillar in thefirst set of pillars is a heavily doped polysilicon layer having a firstconductivity type; the first portion of the first diode component ofeach rail stack is a lightly doped polysilicon layer of a secondconductivity type that is opposite to the first conductivity type; andthe second portion of the first diode component of each pillar in thefirst set of pillars is a lightly doped polysilicon layer of the secondconductivity type.
 14. A non-volatile semiconductor memory according toclaim 12, wherein the plurality of rail stacks is a second plurality ofrail stacks, the semiconductor memory further comprising: a firstplurality of substantially parallel and substantially coplanar railstacks at the second height above the substrate, the first plurality ofrail stacks including the plurality of first conductors.
 15. Anon-volatile semiconductor memory according to claim 12, wherein thestate change element comprises a resistivity change material.
 16. Amethod of fabricating an integrated circuit device, comprising: forminga plurality of substantially parallel and substantially coplanar firstconductors at a first height above a substrate, the first conductorselongated in a first direction; forming a plurality of substantiallyparallel and substantially coplanar rail stacks at a second height abovethe substrate, the rail stacks elongated in a second directionsubstantially orthogonal to the first direction, each rail stackincluding a second conductor and a first portion of a first diodecomponent for a plurality of diodes associated with the rail stack; andforming a plurality of pillars between intersections of the plurality offirst conductors and the plurality of rail stacks, the plurality ofpillars including a first set of pillars formed at the intersection of afirst rail stack and the plurality of first conductors, the first set ofpillars each including a second portion of the first diode component forthe plurality of diodes associated with the first rail stack, a seconddiode component and a state change element.
 17. A non-volatilesemiconductor memory according to claim 16, wherein: the second diodecomponent of each pillar in the first set of pillars is a heavily dopedpolysilicon layer having a first conductivity type; the first portion ofthe first diode component of each rail stack is an intrinsic layer ofpolysilicon; and the second portion of the first diode component of eachpillar in the first set of pillars is an intrinsic layer of polysilicon.18. A non-volatile semiconductor memory according to claim 16, wherein:the plurality of first conductors, the second conductors, the firstdiode components, the second diode components and the state changeelements form a plurality of non-volatile memory cells; the non-volatilesemiconductor memory includes a monolithic three-dimensionalnon-volatile memory array; the plurality of non-volatile memory cellsare formed at a first memory level of the monolithic three-dimensionalnon-volatile memory array; and the integrated circuit includes at leastone additional memory level.
 19. The method of claim 16, wherein: thefirst height above the substrate is higher than the second height abovethe substrate.
 20. The method of claim 19, further comprising: forming afirst conducting layer over the substrate; forming a heavily dopedpolysilicon layer over the first conducting layer; forming an antifuselayer over the heavily doped polysilicon layer; forming a firstintrinsic polysilicon layer over the antifuse layer; applying a firstpattern over the first intrinsic polysilicon layer; etching the firstconducting layer, the heavily doped polysilicon layer, the antifuselayer, and the first intrinsic polysilicon layer in accordance with thefirst pattern, wherein patterning and etching forms strips of each layerthat are elongated in the first direction, the strips including theplurality of first conductors; forming a second intrinsic polysiliconlayer over the first intrinsic polysilicon layer after patterning andetching; forming a second conducting layer over the second intrinsicpolysilicon layer; applying a second pattern over the second conductinglayer; etching the second conducting layer and the second intrinsicpolysilicon layer in accordance with the second pattern to form theplurality of rail stacks, the second intrinsic polysilicon layer formingthe first portion of the first diode component for each rail stack andthe second conducting layer forming the second conductor for each railstack; and etching the first intrinsic polysilicon layer, the antifuselayer and the heavily doped polysilicon layer in accordance with thesecond pattern to form the plurality of pillars.